DESIGN OF STACKED MICROCHANNEL HEAT SINKS USING COMPUTATIONAL FLUID DYNAMIC

The heat extraction problem is becoming an important factor in the development of micro-electronics. Over the last decade, micromachining technology has been increasingly used for the development of highly efficient cooling devices called heat sink because of its undeniable advantages such as less coolant demands and small dimensions. One of the most important micromachining technologies is micro channels. Hence, the study of fluid flow and heat transfer in micro channels which are two essential parts of such devices, have attracted more attentions with broad applications in both engineering and medical problems. Heat sinks are classified into single-phase or two-phase according to whether boiling of liquid occurs inside the micro channels The microchannel heat sink is designed for electronic chips that could be effectively cooled by means of forced convection, by water flowing through the microchannels. This project presents a Computational Fluid Dynamics (CFD) flow simulation modeling, where water is made to flow across different cross-sectional microchannel heat sinks placed on heat source. The flow simulation of water and convective heat transfer are carried by using commercial software “Solid Works Flow Simulation”. In the CFD process stacked microchannels of various cross-sections viz., rectangular, triangular, pentagonal and circular are designed, then by defining the computational domain, boundary conditions as inlet mass flow (1e-5 kg/s),outlet pressure ( static pressure) and heat flux(750w/cm2) and by considering the parallel and counter flow direction of water in different cross-sectional microchannels the temperature drop in heat sink, pressure drop across the channels and amount of volumetric heat transfer coefficient are analyzed and compared.