Stagnation Point Flow of MHD Williamson Nanofluid Due to Non Unifom 191 Heat Source/Sink and Chemical Reaction Over Linear Stretchi
Journal: IMPACT : International Journal of Research in Applied, Natural and Social Sciences ( IMPACT : IJRANSS ) (Vol.6, No. 5)Publication Date: 2018-06-09
Authors : Yasin Abdela; Bandari Shanker;
Page : 189-206
Keywords : Linear Stretching Surface; Stagnation Point Flow; Williamson Nan Fluid; Non Uniform Heat Source/Sink and Chemical Reaction;
Abstract
The numerical solution of stagnation point flow of MHD Williamson nanofluid with the effect of non-uniform heat source/sink and a chemical reaction over a linear stretching surface has been investigated. The governing partial differential equations have been transformed into a system of coupled ordinary differential equations by applying an appropriate similarity transformation. The most applicable numerical method that is the fourth order Runge-Kutta method along with shooting technique has been used to solve the systems of coupled ordinary differential equations. The influence of various parameters associated with the system of the ordinary differential equations such as the velocity ratio parameter λ , the magnetic field parameter, The Williamson parameter W, The chemical reaction parameter γ , the Pr and tl number Pr, the Schmidt number Sc, the Brownian motion parameter Nb, the thermophoresis parameter Nt, the space -dependent * * heat source/sink parameters A and temperature dependent heat source/sink parameter B are analyzed and graphically described. The skin friction Cf, the local Nusselt number Nu, the local Sherwood number Sh, were evaluated for different cases and investigated
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Last modified: 2018-06-09 15:54:21