INTERCONNECTIONS IN MULTILEVEL COMMUTATION SPACE “SYSTEM IN PACKAGE ? PCB”

Journal: Theoretical & Applied Science (Vol.13, No. 5)

Publication Date: 2014-05-30

Authors : Andrey Nikolayevich Antropov; Tatyana Anatolyevna Cheremnykh;

Page : 90-92

Keywords : system on chip; system in package; interconnections; design;

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Optimization of interconnections in design by “Chip ? package - PCB” technology is considered