ResearchBib Share Your Research, Maximize Your Social Impacts
Sign for Notice Everyday Sign up >> Login

HTCC APPROACH FOR PACKAGING MEMS ACCELEROMETER SENSORS AND ASSOCIATED ROIC

Journal: International Journal of Advanced Research (Vol.6, No. 7)

Publication Date:

Authors : ;

Page : 537-552

Keywords : MEMS sensors HTCC XY accelerometer Z Axis accelerometer ROIC QFN.;

Source : Downloadexternal Find it from : Google Scholarexternal

Abstract

Problems associated with assembly and packaging of two accelerometer Micro Electro Mechanical Sensors (MEMS) and associated Read Out Integrated Circuit (ROIC) into a single compact package as per customer requirements were discussed, analysed and a High Temperature Co-fired Ceramic (HTCC) solution was suggested.

Last modified: 2018-08-22 18:03:47