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HTCC APPROACH FOR PACKAGING MEMS ACCELEROMETER SENSORS AND ASSOCIATED ROIC
Journal: International Journal of Advanced Research (Vol.6, No. 7)Publication Date: 2018-07-10
Authors : K. S. R. C. Murthy.;
Page : 537-552
Keywords : MEMS sensors HTCC XY accelerometer Z Axis accelerometer ROIC QFN.;
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Abstract
Problems associated with assembly and packaging of two accelerometer Micro Electro Mechanical Sensors (MEMS) and associated Read Out Integrated Circuit (ROIC) into a single compact package as per customer requirements were discussed, analysed and a High Temperature Co-fired Ceramic (HTCC) solution was suggested.
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Last modified: 2018-08-22 18:03:47