DEVELOPMENT OF METHODOLOGY OF THE HEAT SINK THERMAL ASPECT FOR LOW COST EFFECTIVE CFD SOLUTIONS FOR REASONABLY HIGH QUALITY DESIGN

The present focus is to optimize thermal aspects for low cost effective CFD solutions of for the analysis of the reasonably high -quality design. Although the method adopted for the current study is a well-known idea that is are described order reduction techniques based on the transitional approach of POD and SVD to evaluate the thermal cooling aspects of circuits. The model was done on ten Watt power source IC system mounting and manufactured for an automobile application. A proper Computational Fluid Dynamics simulation was shaped to optimize the most crucial piece of the board and a valid and appropriate result has been entered. Based on the MOR techniques that are applied to on the obtained results of the simulation were compared and included into the design, the modified order reduction method successfully able to approximate and standardize the cooling load and design constraints of the selected board. KEYWORDS: CFD Solutions, Power Source, MOR Techniques & Reduction Method