Design of Continous Set up for Synthesis of Metallic Membrane by Electroless Copper Plating

The electro less plating method use in metal plating on a porous substrate is disclosed. the deposition of metal ion is done by selective contact of the plating metal salt solution with a reducing solution on the activated surface on or inside the porous substrate. Before plating process The process is accomplished by first treating with the active catalytic colloidal composition solution to provide additional active nuclei on the substrate surface, the activated substrate is then contacted with an electroless plating bath.Continuous set up is design for catalytic activity of the porous substrate by using nickel chloride as activator and for the Continous plating process using completely porous substrate with plating solution and reducing solution. The plating process in the setup is useful as it is unmanned, automatic operation for preparation of composite metallic membrane among considerably no crack or pinholes. The electro less plating method use in metal plating on a porous substrate is disclosed. After membrane form the characterization of the membrane is done by SEM and XRD.