Characterization of Structural Properties and Harden Enhancement of Al-Cu-N by Thin Film Coating

Two series of Al-Cu-N films containing Cu were grown by DC / RF magnetron sputtering of two elemental targets in an Ar / N & sub2; Gas mixture deposited by biasing a high-speed steel substrate. The effects of Cu content and deposition conditions were investigated with respect to the microstructure, morphology and mechanical properties of the films. The structure and mechanical properties of these films were dependent on the copper concentration. X-ray diffraction analysis and high-resolution and standard transmission microscopy analyzes show that the particle size in the film decreases with increasing copper content, but the sign of the copper-cutting content has not been determined. The micro hardness and adhesion of the coating/substrate were analyzed with a micro hardness tester and a scratch test.