Effect of Different Pretreatment Processes on ABS Resin Surface on Electroless Copper Plating

The surface of ABS resin was pretreated by different pre-treatment processes such as polishing, lye cleaning or corona discharge treatment, and then 6-(3-triethoxy) was prepared on the surface of different pretreated ABS resin by self-assembly technique. Silicone propyl) ammonia-1,3,5-triazine-2,4-dithiol monosodium salt (TES) film was subjected to electroless copper plating. The surface state of ABS resin and the surface appearance after electroless copper plating were characterized by contact angle measuring instrument, scanning electron microscope (SEM) and adhesion test. The results show that the surface contact angle of the ABS resin after corona discharge treatment is 46.3° compared with the surface of the ABS resin after the lye cleaning and polishing treatment, and the hydrophilicity is good, which is beneficial to the surface of the ABS resin. Formation of a silane self-assembled film. The results of electroless copper plating show that the copper layer formed on the surface of the polished ABS resin has poor uniformity and large copper particles; the copper layer prepared on the surface after alkali treatment is dense and uniform, but easy to fall off; the surface after corona treatment The copper layer is dense and uniform, and the copper particles are small and have good connectivity to the substrate.