Clip-Attach EMI Shielding on Electronic IC Package

Since the earliest days of radio and mobile communication, the need of managing the negative effect of electromagnetic interference (EMI) became necessary. The existence of EMI or radio-frequency interference inside the electronic system affects the performance of the device on its actual application, and on worst-case scenario it might stop the system from functioning. However, as the development and breakthrough in electronic integrated circuit (IC) packaging progress, different solution is offered in providing an advantageous approach for EMI shielding and protection. In this paper, an augmented and improved packaging technique for electronic IC is discussed in details providing the package design and the method of its fabrication.