Package Chipping Elimination through Indented Sidewall Integration

— The paper presents an alternative semiconductor package design for quad flat no-lead (QFN) devices to eliminate the occurrence of topside chipping rejection during mechanical singulation. The discussion includes a unique design of mold chase for plastic encapsulation process of a semiconductor device and a specialized singulation mechanical cutting technique. Moreover, authors' insights are shared to realize the manufacturability of the augmented design and process during assembly especially on the critical process steps of “molding” and “singulation