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Using a Normalized Stress Index in Solving Die Attach Glue Crack Problem
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Jefferson S. Talledo;
Page : 1-2
Keywords : Glue crack; die attach; normalized stress; adhesion strength; thermal cycling; stress analysis;
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Find it from : Google Scholar
Abstract
QFN (quad flat no lead) package is a popular type of leadframe-based semiconductor package. The silicon die is attached
to the leadframe die pad using die attach glue material
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Last modified: 2020-06-14 20:24:53