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Comparative Analysis for Die Attach Dispensing Methods
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Michael D. Capili;
Page : 170-172
Keywords : Die Attach process; Dispensing Methods;
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Abstract
Die attach, also known as die bonding, is the process of attaching (or bonding) a die (or chip) to a substrate, leadframe or another die. This process can take on many forms and can be applied in many different ways. The common die attach material is Epoxy
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Last modified: 2020-06-16 15:40:26