Addressing Package Crack during Frame Mounting by Defining Appropriate Mounting Roller Kit
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Alvin S. Soreda Ernesto T. Antilano Jr.;
Page : 203-205
Keywords : ;
Abstract
Package Tape sawing process requires mounting of molded strip package into Ultraviolet (UV) Tape by means of manual, semi-automatic and automatic mounting process. Manual and Semi-automatic mounting process have high risk of package crack means by intervention of human handling and machine mechanical failures. Risk level of Package crack is inversely proportional to the thickness of a strip package. The thicker the strip package, the lower the risk of package crack. On the other hand, the Thinnest the strip package, the highest the risk of package crack.
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Last modified: 2020-06-16 15:50:04