Addressing Package Chip Out Corrective Action Through Point to Point Sensor to Detect Dislodge Units

Package Singulation process is a form of process aimed to individually separate the units from strip package at full cut singulation.  After Package Singulation (either Jig saw or Tape saw) the separated units will undergo transferring process from package singulation dicer to Pick and Place tray for 100% Visual Mechanical Inspection (VMI). Figure 1.0 below is a simple process flow diagram of a Dicer with auto pick and place transferring module after sawing of a strip type package