Multiple Jet Air Cooling to Study the Heat Transfer Phenomenon

Due to the rapidly decreasing size of the electronic components and its increasing capacities. The cooling of these components is a challenging problems in today's electronic world. The direct contact cooling using multiple air jet is more effective method to remove the heat flux in a faster manner compared to other conventional methods. In the present investigation a jet diameter of 0.25mm and 0.5 mm is choosen. The heat flux range of 20 to 180W/cm2 is considered which is a typical range for the electronic components. The test plate used is made of copper it is chosen because of its higher thermal conductivities. The Reynolds number range of 1000 to 4600 were considered. Results show that heat transfer co-efficient increases with increase in heat flux.