Numerical Study of the Heat Dissipation of Rectangular Heat Sink Under Natural Convection with Different Slots

In the present scenario, the digital life and its usage are increasing rapidly. In all electronics, electrical current flow through the resistive elements says electric chip. When the current flowing through it, the heat is generated under natural convections. Due to the heat generation in electronic parts, the components will be failure during the temperature rise. In power electronics, chips face thermal heat removal challenges. For better conditions and performance, care must be taken to cool chip systems. There is an effective way to remove the heat whenever the heat sink attached above the chip it removes the heat efficiently and it keeps the chip lower in temperature. The performance of the heat sink is related to its slots. In this research work, for numerical simulation under particular plate-fin, with slots work improved than the plane surface, different slots shape enhanced to find better one of the rectangular fins heat sink