LIQUID COOLING FOR 3D MICROPROCESSORS PROCESSORS

In today's world 3D ICs and microprocessors are the latest technique and most promising way that the total wire length and interconnect lengths can be reduced dramatically. But without a way to efficiently cool these 3D IC they suffer significantly due to major heat accumulation in between the layers which effects its reliability and performance. This can cause the Chip to fail. In this project we take a look at the advantages of liquid cooling for 3D microprocessors .We also evaluate the leakage power consumption and the lifetime reliability depending on the temperature of each functional unit in the 3D multi-core processor along with modelling and dynamic management of multicore systems and look at the liquid cooling setups for CPU, along with a quick glance at the future of liquid cooling which involves a complex interconnected layout of both Fluidic and electrical TSVs to design these modern 3D ICs and microprocessors.