ON TOPOLOGICAL PROPERTIES OF TRIPLE BASE HIERARCHICAL INTERCONNECTION NETWORK ON VERTEX-EDGE AND EDGE-VERTEX DEGREE

Hierarchical interconnection networks (HINs) allow a structure for designing networks in such a way that they reduce link cost by taking dominance of the locality of communication that exists in parallel applications. HINs use multiple levels. Lowerlevel networks help us in local communication while remote communication is done by higher-level networks. In the presence of some inoperative nodes and/or links HINs plan fault tolerance. Existing HINs can be mainly classified into two classes. First class uses nodes and/or links replication while other deals with standby interface nodes. The first class integrates Hierarchical Cubic Networks, Hierarchical Completely Connected Networks, and Triple-based Hierarchical Interconnection Networks. The second one incorporates Modular Fault-Tolerant Hypercube Network and Hierarchical Fault Tolerant Interconnection Network. In this paper, we evaluate formulas of General Randic index for contrasting values of α , First zagreb alpha index, First zagreb beta indrx, atom-bond connectivity (ABC) index, geometric arithmetic GA index, the fourth ABC index (ABC4) , fifth GA index GA5 on the basis of vertex-edge and edge-vertex degree for triple-based hierarchical interconnection network (THIN)