Experimental Analysis of Heat Pipe for a Computer Processing Unit

Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling. The thermal resistance of materials is of great interest to electronic engineers, because most electrical components generate heat and need to be cooled. Some electronic components malfunction when they overheat, while others are permanently damaged. It aims at thermal analysis of a heat-pipe and heat sink of Computer Processing Unit (CPU) which is particularly useful in energy-conservation equipment where it is desired to recover heat from hot gases for air-preheated or supplemental heating applications. In some cases the heat-pipe can take the place of more costly combinations of pumps, piping and dual heat-exchange configurations, further in this regard, design and theory is vital. Design of different heat pipes, heat sinks and heat transmitting systems are important based on the geometry and profile. It has to be designed optionally. In this CATIA software is used for designing various heat-pipes and heat sink systems which are used in heavy machinery. Secondly, thermal analysis is made by using ANSYS 8.1 software which calculates the temperature distribution and related thermal quantities in a system or component.