COMPARATIVE ANALYSIS OF THE MAIN PARAMETERS AND RELIABILITY INDICATORS OF SINGLE-STAGE THERMOELECTRIC COOLING DEVICES WHILE USING DIFFERENT COMBINATIONS OF INITIAL MATERIALS SETTINGS OF A SIMILAR EFFICIENCY

A comparative analysis of the basic parameters and reliability indicators of the single-stage thermoelectric cooling devices while using different combinations of settings compared to traditional initial materials of a similar efficiency for changes in temperature from 0 to 60 K and operation modes from maximum cooling capacity to the minimum failure rate is presented. It is shown that the use of initial materials with higher conductivity compared to the traditional means to increase the cooling capacity or to reduce the number of elements, to increase the thermoelectric cooling power, to reduce the failure rate and thereby to increase the probability of thermoelectric cooling device failure-free operation. It was obtained the simple ratios of interrelation of parameters and indicators of reliability for a variety of combinations of initial materials depending on the thermoelectric cooling power and temperature differential. It is shown that under the condition of a constant heat load and temperature difference parametric constants of thermocouples amount on the thermoelectric cooling capacity production. Analysis of the traditional version failure rate and other combinations of failure rate had helped to identify that the failure rate production on the maximum thermoelectric power is a constant for any combinations of the parameters of the source material, for any operation mode and temperature difference. The possible application of the superposition principle when building a single-stage thermoelectric cooling devices of a high reliability by combining of a constructive method (mode selection of thermoelectric cooling devices) and parametric method (selected combinations of the initial material) were discussed. It’s shows the application of the principle of superposition of structural and parametric methods of construction of thermoelectric cooling devices could significantly increase the reliability of thermoelectric cooling devices.