Transient Analysis Based Delay Model and Effect of Conductance on On-Chip High Speed VLSI RLCG Interconnection: A Review
Journal: International Journal of Science and Engineering (Vol.1, No. 1)Publication Date: 2013-04-15
Authors : Shilpi Lavania;
Page : 15-24
Keywords : Time domain analysis; RLCG Interconnect; High Frequency Effect; Electron Migration; Proximity Effect; Delay;
Abstract
Transient response of any system depends upon the initial conditions. In this paper a review on the transient response under various conditions is represented. Apart from the transient response this paper strives to represents a review of the effect of conductance on the delay under various technologies applied to interconnect field. Interconnects are the back bone to any high density chip. Along with the transient response, conductance effect the introduction of high frequency effect i.e. proximity, skin effect and electron migration is also reviewed in this paper. The model which is reviewed is an RLCG interconnect model
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Last modified: 2013-09-26 20:11:44