Deformation in Silicon Wafers: Influence of Material Symmetry and Boundary Conditions

The spatial displacement of a silicon wafer in a mounting is studied using finite elements including stress-strain relations, frequency analysis and gravity load. Simulations of various mounting configurations visualize the dependence of deformations and eigenmodes on boundary conditions such as positioning of four fixation points at the rim, the orientation of the wafer in the geometry and of the relative orientation of the crystallographic axis of this orthotropic material with respect to the wafer plane.