Electronic Interposer for Wirebonding Improvement on Semiconductor Electronic Device

The miniaturization of integrated circuit (IC) becomes the common direction for semiconductor electronic industries, converting the electronic devices to get smaller in size yet with increased number of functional components. Aligned with this common goal is to continuously improve the manufacturing and assembly side of semiconductor devices as well to be able to adapt to the fast changing requirement of technological breakthrough. Through integrating an interposer in the current design of substrate-based electronic product, the assembly limitations and capability can be significantly improved, thus devices with tight clearance requirement or devices with gross assembly rejection related to tight clearances can be provided with reliable alternative solution and process improvement