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Journal: Scientific and Technical Journal of Information Technologies, Mechanics and Optics (Vol.20, No. 1)

Publication Date:

Authors : ;

Page : 52-57

Keywords : additive technologies; 3D ceramic printing; stereolithography; ceramic paste; ceramic suspension; debinding; sintering; shrinkage;

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Subject of Research. The paper presents the study of 3D printing modes and heat treatment effect of ceramic thinwalled plates with dimensions of 20 × 5 × 40 mm. The relationship is determined between 3D printing, heat treatment and the percentage of shrinkage and surface quality of the obtained ceramic parts. Method. Ceramic parts were created using 3D printing by laser stereolithography. Heat treatment of parts was carried out by dividing the samples into three groups. Each group was located in the furnace in one of the three positions: in a metal box under quartz layer, under a layer of zirconium balls and on the surface of zirconium balls. Main Results. We have compared the surface quality and the shrinkage percentage of the samples, the thickness of the printed layer of 25, 50 and 100 μm and heat-treated under the indicated conditions. An improvement in the surface quality of the samples was found with the decrease in the layer thickness and particle size of the ceramic powder (from the range of 1-5 μm to the range of 0.01-1 μm). The shrinkage percentage of the product decreases by about 2 times with increase in the duration of heat treatment and the percentage of powder in the ceramic suspension. Practical Relevance. The use of new 3D printing modes and improved heat treatment conditions gives the possibility to obtain samples with better surface quality and lower percentage of shrinkage. The proposed technological process of laser stereolithography provides the creation of thin-walled ceramic products of higher quality with high accuracy of geometric dimensions. The results obtained make it possible to use the applied modes and methods for creating ceramic objects in such industries as aircraft manufacturing, radio electronics, medicine and other industries.

Last modified: 2020-02-26 22:00:28