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Process and Design Optimization of Electronic Package with Complex Stacked Dice Configuration

Journal: International Journal of Scientific Engineering and Science (Vol.3, No. 9)

Publication Date:

Authors : ;

Page : 5-6

Keywords : Stacked dice; electronic device; semiconductor; process improvement; package design;

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Abstract

Bly of semiconductor electronic devices. This paper presents the advantage of securing a robust design architecture for specailized electronic devices to minimize the potential show stopper in the realization of high-end technology during assembly manufacturing.

Last modified: 2020-03-18 14:43:28