Leadframe Design Enhancement for Die Attach Improvement

Design modification is one of the alternative approach to adjust the standard of a certain configuration into a specified limit or to provide a potential solution to incapability of the current situation. This paper presents a leadframe carrier design incorporated with a stand-off structure that will maintain a consistent bond line thickness criteria for quad flat no-lead (QFN) assembly and similar application. Manufacturing simplification is the primary goal of the modification with secondary matrix of reliability and quality improvement as well. The fabrication method and insights from the authors are also discussed