Realization of a QFN with Multiple I/O Interconnection Robustness

Nowadays, the current technology for Quad flat nogrid multi row (QFN-mr) packages are restricted only to dual arrays of I/O (input/output) due to the assembly and process limitations for triple arrays of I/O design for QFN. During implementation of triple or more arrays of I/O, different assembly challenges especially from wirebond and molding process are highlighted.  One of the inputs from wirebond process related to the design of triple or more arrays of I/O is the occurrence of long wire connection between the silicon die and the 3 rd array of I/O.  A long wiring con