Improving the Robustness of a Board-Mounted DFN Package
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Jefferson S. Talledo;
Page : 452-452
Keywords : DFN; robustness; board-mounted package; package crack; die pad solder.;
Abstract
A DFN (dual flat no lead) is a leadframe-based package that has metal pads only along the two sides of the bottom surface. As shown in Fig. 1, the metal pads are soldered to the PCB (printed circuit board) to create the required electrical connection.
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