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Reduction of Copper(II) Oxide on Bare Leadframe Through N2 Atmosphere Curing

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date:

Authors : ;

Page : 574-574

Keywords : —Semiconductor; Oxidized; leadframe; nitrogen gas QFN Quad Flat No leads;

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One of the recognized candidate for the base material of leadframe is copper due to its abundance in resources and inexpensive cost as compared to other noble material such as silver and gold.  Leadframe is the direct material used for Quad Flat No-lead (QFN) and Quad Flat No-lead packages (QFP) assembly.  During manufacturing, the leadframe is used to carry the silicon die and wire until the unit is encapsulated.  Illustrated in Fig. 1 is the QFN Assembly process flow

Last modified: 2020-06-13 17:02:22