Foreign Material Removal through Optimization of Vacuum and Blow FM Kit

— System and method for applying a FM kit to remove the foreign material during Die Attach process through Vacuum and Blow pressure release to a surface of the semiconductor Leadframe or substrate to remove particulate contaminants or foreign material that may have been collected thereon. The Clean Dry Air (CDA) blow pressure-release to which the foreign material is adherent is peeled off or removed from the surface of the leadframe or substrate. Advantageously, a vacuum also installed in FM kit to suck the foreign material in order to increase the efficiency in removing the foreign materials