Influence of Аl and Mn impurities on structural processes transformations in copper alloys

In the work on specific examples involving real copper-based alloys containing 14 weight.%Al and 3 weight.%Mn, describes the results of a study of the process of restoring the shape of a material that was defomated according to the three-point bending scheme. The studies were carried out by measuring changes in the temperature dependence of the electrical resistance and deflection of the sample, as well as by obtaining microelectronograms using an electron microscope. Since SME alloys operate under conditions of mandatory thermal cycling, the elucidation of the thermal stability of these materials is of practical interest. It is established that martensitic crystals that occur in hardened samples have a high density of packing defects and thin twins formed on the (121) γ´ plane. One of the important features of the martensitic mechanism is the obligatory formation of martensite with defects, which is a fine structure. By comparing the curves of the electrical resistivity and the deflection, it was found that the temperature range of the increase in the deflection upon cooling coincides with the temperature range of the direct martensitic transformation. In addition to stacking faults, thin twins with a thickness of 0.01-0.04 microns are also observed in martensite crystals. It was found in the analysis that twinning in martensite occurs along the {121} γ´ plane. It is shown that the streakiness arising during martensitic transformations is caused by stacking faults, which lie in the {121} plane at a high density of stacking faults.