Thermal Characterization of Electronic Package with Non-Uniform Power Maps

Resistance to flow of current through the transistors in a silicon chip of semiconductor device results in heat generation. The generated heat should be removed substantially to ensure the reliability and proper functioning of the electronic device. In order to maintain the temperature of the die within the design limits, thermal management of the electronic package should be carried out. Silicon with multi-core processors which execute tasks in parallel will result in a nonuniform power distribution with hot spots. In this paper, a steady state thermal analysis of a Flip Chip Ball Grid Array Package (FCBGA) with a non-uniform power loading has ben carried out using Ansys Workbench. Surface temperatures of the components under uniform and non-uniform power loading were found and methods of reducing max junction temperature (Tj) and temperature uniformity of non-uniform power were analyzed. In this study, significance of Integrated Heat Spreader (IHS), heat Sink and Thermal Interface material (TIM) in reducing Tj were evaluated. First, the impact of variation in the thickness of the IHS, heat sink, and silicon are observed. Then, the impact of thermal conductivity of IHS with varying anisotropy factors and thermal conductivity of TIM in reducing Tj are evaluated. These studied will help in identifying promising materials for better thermal management of electronic package with nonuniform power loading