Study of Effect of Temperature on Electrodeposition of Copper from Copper-Sulphate Solution

? Electrodeposition of metals from electrolyte under certain conditions results in dendritic pattarns exhibiting fractal character. The underlying process responsible for development of dendritic tree like structures with complex branches is the Diffusion Limited Aggregation (DLA). In order to realize DLA like conditions the cell operating conditions play an important role. We studied the growth of electrodeposits from copper sulphate solution under different cell operating conditions and the effect of temperature on the nature of electrodeposit is studied using the concept of fractal dimension. Box counting technique is used for the estimation of fractal dimension of the electrodeposit, details are presented.