DEVELOPMENT OF RELIABILITY ASSESSMENT TECHNIQUE FOR WAFER TRANSFER ROBOTJournal: International Journal OF Engineering Sciences & Management Research (Vol.4, No. 3)
Publication Date: 2017-03-30
Authors : Baek Ju Sung;
Page : 30-34
Keywords : Wafer Transfer Robot; Repeatability; Reliability Assessment; Failure Analysis; Accelerated Model;
Semiconductor process that requires high accuracy is subjected to severe impact by slight impact or some impurities. Furthermore, it has more difficult to maintain the basic performance under the extreme operating conditions like a vacuum, high temperature, etc. The wafer transfer robot is a precise control robot for accurately pass the semi-finished product(wafer) to a next process in the semiconductor display production line. This equipment should have stability at high temperatures and to can detect the loading state of a wafer. Reliability of the robot is directly related to the reliability of the manufactured semiconductor. In this paper, the failure analysis materials for the wafer transfer robot was drew up and determined the tests items, and calculated the accelerated life test time for reliability assessment. And, the main performance tests of the improved wafer transfer robot were performed, and the results were analyzed .
Other Latest Articles
Last modified: 2017-03-20 18:36:05