Overcoming Some of the Challenges in 3D Micro-Assembly Techniques to Package MEMS Devices

This article compiles the most important packaging techniques for micro electromechanical systems (MEMS). In addition, the main electrical interconnection techniques are investigated: wire-bonding, tape automated bonding (TAB), adhesive-based bonding, and flip-chipping. For each specific technique, some examples are demonstrated which were developed or adapted in our lab. A low cost micro-dispensing technique has been developed to run precise dispensing using manual dispensers. An improvised approach of using flexible printed circuit boards (PCBs) as well as conventional solid PCBs is depicted to electrically bond MEMS prototypes and prepare for tests. This article demonstrates adapting 3D printing for packaging of overhanging MEMS structures. This packaging technique is known for its low cost and quick manufacturing capacity and it is also capable of building structures with bio-compatible materials. Additionally, a small vacuum chamber has been designed and manufactured to examine the mechanical response of MEMS devices under vacuum before fully package them. Although this paper provides a platform to deal with some of the main 3D packaging challenges, the same techniques could be expanded for numerous applications and for mass production of MEMS devices.