MODELING AND SIMULATION OF THERMAL BIMORPH SENSOR USING COMSOL
Journal: International Journal of Electronics and Communication Engineering and Technology (IJECET) (Vol.8, No. 2)Publication Date: 2017-03-07
Authors : B.Jyoti; S. V. Halse;
Page : 67-74
Keywords : MEMS; Thermal sensor; Thermal bimorph;
Abstract
In this paper, modeling and simulation of Thermal bimorph which can be used as one of the Thermal sensor and actuator of MEMS field. The results of Thermal bimorph displacement are investigated by choosing different material layers and different geometry and varying temperature. The thermal bimetallic effect can be used for both sensing and actuation purposes. This mechanism allows temperature variation in microstructures to be exhibited as transverse displacement of mechanical beams. In this paper displacement is studied for two different material layers. As the thickness of the beam increases the displacement reduces as the temperature increases the displacement increases. The proposed bimorph may find application in household electromechanical thermostats.
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Last modified: 2017-08-07 17:00:19