IMPROVING PRINTING PROCESS IN REFLOW AND THICK FILM TECHNOLOGY THROUGH ANALYSIS AND MODELING OF PASTE RHEOLOGY
Journal: PRODUCTION ENGINEERING ARCHIVES (Vol.2015, No. 7)Publication Date: 2015-04-30
Authors : Eszter Horvath;
Page : 11-15
Keywords : solder paste; thick film paste; printing process; constitutive model; rheological measurement; numerical method;
Abstract
In the automotive industry the use of modern technology and provision of the highest quality product and related services is the most important element of rivalry between global corporations and motorcycles. In a competitive struggle for the recognition of its brand in the automotive market, global organizations continuously raise the requirements for quality management systems, so that the finished prod-uct meets all the standards in terms of safety and quality and satisfies the ever-growing needs of customers - present and future drivers and passengers of cars. ISO/TS 16949 quality management system is presented in this paper. The framework for customer specific requirement is illustrated as well as prevention of problems.
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