MODEL REDUCTION OF CFD SIMULATION OF INTEGRATED CIRCUIT COOLING OF AN ELECTRONICS PACKAGING

The present work deals with the optimization of computational resources for the design, estimation and analysis of the heat sink thermal aspect for low cost effective CFD solutions for reasonably high quality design. Even though the method adopted for the present problem is an established idea we have described order reduction techniques based on the intermediate approach of POD and SVD to assess the thermal cooling aspects of circuits. The model was done for ten Watt power source IC system developing and manufactured for an automobile application. A proper Computational Fluid Dynamics simulation was made to optimize the most crucial part of the board and a valid and suitable solution has been recorded. Based on the model order reduction techniques that are applied the results of the simulation were compared and integrated into design, the modified order reduction method successfully able to estimate and calibrate the cooling load and design constraints of the chosen board.