MECHANICAL BEHAVIOUR OF COPPER ALLOY WITH DIFFERENT STRAIN RATE AT ROOM TEMPERATURE

This study consist mechanical behavior of copper alloy which contains 6.75% by weight of zinc and 0.68% of lead by weight with varying rates from 0.1 s -1 to 0.0001 s - 1 tested at room temperature. After tensile test it was observed that ultimate tensile strength vary from 667 MPa to 549 MPa, yield strength vary from 461 MPa to 412 MPa and ductility changes from 26.1% - 30.70% at strain rate of 0.1 s -1 to 0.0001 s -1 . The specimens are characterized by optical microscopy to study microstructure change of gauge surface during tensile testing. The study shows that the grains become finer with the decrease in strain rate. Dimple formation in the Scanning Electron Microscopy images validates the ductility of the specimens, and it was found that as the strain rate decreases the dimple formation increases, which implies an increase in ductility. It is also found that hardness is vary from 107 HV1 to 94.67 HV1.