ANALYSIS OF THERMAL STRESSES IN THIN CIRCULAR PLATE DUE TO MOVING HEAT SOURCE

It is necessarily important to investigate thermal stresses in a thin circular plate due to internal moving heat source. In the present research article, a problem of thermal stresses in circular plate is examined by integral transform technique. This paper convolutes a plot of thermal stresses in thin circular plate due to internal moving heat source. Transfer of heat takes place from the center of plate to periphery of the plate. The behavior of stresses due to initial temperature and final temperature is investigated from lower face to upper face by keeping circular edge thermally insulated. Transfer of heat takes place by conductive mode from lower to upper surfaces. The plate mentioned in the present article is studied on the assumption that there is no effect of surrounding temperature. As a unique case, metallic plate is considered and the outcomes for thermal stresses are computed numerically and graphically. The obtained results based on gold, silver and copper established that maximum strain has occurred in a round plate of silver followed by gold plate.