Package Chipping Elimination through Indented Sidewall Integration
Journal: International Journal of Scientific Engineering and Science (Vol.3, No. 9)Publication Date: 2019-15-10
Authors : Package Chipping Elimination through Indented Sidewall Integration;
Page : 67-69
Keywords : Quad flat no-lead; mold chase design; package chipping elimination; design improvement;
Abstract
— The paper presents an alternative semiconductor package design for quad flat no-lead (QFN) devices to eliminate the occurrence of topside chipping rejection during mechanical singulation. The discussion includes a unique design of mold chase for plastic encapsulation process of a semiconductor device and a specialized singulation mechanical cutting technique. Moreover, authors' insights are shared to realize the manufacturability of the augmented design and process during assembly especially on the critical process steps of “molding” and “singulation
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