Enhanced Wirebond Process Plate for Reduction of Non-Stick on Leads on Leadframe Device

Quad-flat no-leads (QFN) is a type of leadframe device in semiconductor industry wherein the silicon chip or die is mounted on leadframe pad through a die attach glue or film. One option for the input/output (I/O) signals from the silicon die are then connected I/O leads through wirebonding process. During package development stage of a standard QFN product, one major challenge needs to address is the bouncing of leads during the wirebonding process on a no-tape leadframe. A typical assembly process flow