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A Study of Die Attach Process for Thin BGA Substrate Packages

Journal: International Research Journal of Advanced Engineering and Science (IRJAES) (Vol.4, No. 2)

Publication Date:

Authors : ;

Page : 86-90

Keywords : Die attach; diebonder; pick-up tool; DAF; BGA.;

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Abstract

The trend now in semiconductor manufacturing is to produce smaller and thinner packages especially semiconductor packages for mobile applications. This also comes with challenges in the production and development of such less sized packages. As the package becomes smaller and thinner, the assembly manufacturing process becomes more complex. This technical paper presents innovative approach in die attach station on critical handling of thin die packages. Lessons and learning were documented for Ball Grid Array (BGA) packages as first to be evaluated with thin package requirements. Discussed herewith are documented defects and related issues during trials and die attach builds that proved to be of difficulty on its early production

Last modified: 2020-03-20 15:36:41