Overcoming Design Challenges on Ultra-Thin Substrate-based Packages

Ultra-thin substrate-based package is one of the promising technologies that can offer a large variety of geometrical possibilities, specifically for the telecommunications industry. One eminent technology is a foldable mobile phone in which miniaturization of internal components provides a major challenge in the manufacturing and assembly processing. In order to achieve ultra-thin based packages, thinned silicon and low loop wirebonding profile must be applied to provide appropriate dimension in the packaging technology. In addition, to overcome these design challenges, copper carrier was explored. The assembly process includes a pre-mount copper carrier on ultra-thin substrate which offer stiffness during the handling process from die attach assembly, wirebonding and mold encapsulation. After molding process by compression, the copper carrier is stripped off to expose the ball land on a ball grid array package for the next assembly process.