Specialized Mold Chase Design for Semiconductor QFN Leadframe Package

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date: 2019-15-07

Authors : Rennier S. Rodriguez Frederick Ray I. Gomez;

Page : 45-45

Keywords : QFN; leadframe; mold chase; semiconductor package; package singulation.;

Source : Download Find it from : Google Scholar

Abstract

Package chip-out in Fig. 1 is a common defect frequently encountered in end-of-line process at the semiconductor assembly manufacturing, and is defined as a region of material missing from a body

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Specialized Mold Chase Design for Semiconductor QFN Leadframe Package

Abstract

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