Tape and Reel Punch Hole Augmentation for Machine Detection Improvement
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Edwin M. Graycochea Jr. Antonio R. Sumagpang Jr. Frederick Ray I. Gomez;
Page : 250-250
Keywords : Punch hole; tape and reel; micromodule; semiconductor; die bonding; process improvement; cycle time.;
Abstract
Tape and reel process is one of the new technologies in semiconductor industry, with one key challenge in die attach process because of the reject hole on the tape Illustrated in Fig. 1 is the typical assembly process flow for tape and reel process, specific for the micromodule device with applications namely security devices, automated teller machines, and sim cards
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