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Tape and Reel Punch Hole Augmentation for Machine Detection Improvement

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date:

Authors : ;

Page : 250-250

Keywords : Punch hole; tape and reel; micromodule; semiconductor; die bonding; process improvement; cycle time.;

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Abstract

Tape and reel process is one of the new technologies in semiconductor industry, with one key challenge in die attach process because of the reject hole on the tape  Illustrated in Fig. 1 is the typical assembly process flow for tape and reel process, specific for the micromodule device with applications namely security devices, automated teller machines, and sim cards

Last modified: 2020-06-11 19:53:44