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Pepper Pot Design Augmentation for Small Die Sizes
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Edwin M. Graycochea Jr Rennier S. Rodriguez Bryan Christian S. Bacquian;
Page : 317-317
Keywords : Micro Module packages; Semiconductor; Die Attach; Chip out: Silicon die;
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Abstract
Nowadays, the die technology and die sizes becomes smaller from 1mm up to the range of 0.4 to 0.8mm for micro module semiconductor packages. As the die size requirement for incoming technology shifts, the die attach process becomes the challenging part of integrated circuit assembly
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Last modified: 2020-06-12 20:14:51