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Pepper Pot Design Augmentation for Small Die Sizes

Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)

Publication Date:

Authors : ;

Page : 317-317

Keywords : Micro Module packages; Semiconductor; Die Attach; Chip out: Silicon die;

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Abstract

Nowadays, the die technology and die sizes becomes smaller from 1mm up to the range of 0.4 to 0.8mm for micro module semiconductor packages.  As the die size requirement for incoming technology shifts, the die attach process becomes the challenging part of integrated circuit assembly

Last modified: 2020-06-12 20:14:51