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Analyzing Failure in a Micromodule Package using Stress Modeling Approach
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Jefferson S. Talledo;
Page : 357-357
Keywords : Micromodule; potting; mechanical modeling; die stress; die crack; finite element model;
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Abstract
A micromodule package considered here uses potting compound as encapsulation material. Protected by the potting is an IC (integrated circuit) silicon die attached to the substrate as shown in Fig. 1.
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Last modified: 2020-06-12 20:34:33