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Die Attach Process Advancement for Reduction of Damaged Substrate Strips for Thin Applications
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 3)Publication Date: 2019-15-07
Authors : Michael D. Capili Frederick Ray I. Gomez;
Page : 398-400
Keywords : Substrate; warpage; damaged strips; die attach process; workholder;
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Abstract
Today more than ever, cost reductions push the industry towards larger strip formats and thin substrate in manufacturing for efficiencies at high-cost processes. This is also true for maximizing material potentials and labor at the processing steps. These larger strip sizes in Fig. 1 offer high strip density and reduce labor and factory costs.
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