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QFN Strip Warpage Reduction through Modeling of the Impact of Package and Leadframe Thickness
Journal: International Research Journal of Advanced Engineering and Science (Vol.4, No. 4)Publication Date: 2020-08-15
Authors : Jefferson S. Talledo;
Page : 3-4
Keywords : — Strip warpage; leadframe thickness; package thickness; quad flat no lead; modeling; finite element analysis.;
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Find it from : Google Scholar
Abstract
A QFN (quad flat no lead) package is usually assembled in a molded leadframe array strip format as shown in Fig. 1. After molding at high temperature (~175 oC) and cooling down to room temperature, singulation of the individual units from the full leadframe array strip is done to isolate the individual QFN package units.
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Last modified: 2020-06-14 20:25:55